 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| Rote Punktlichtquelle Red Pointsource Emitter Lead (Pb) Free Product - RoHS Compliant SFH 4276 Nicht fur Neuentwicklungen / Not for new designs Wesentliche Merkmale * Schwarz eingefarbtes TOPLED-Gehause * Typische Emissionswellenlange 655nm * Runde Emissionsflache mit Durchmesser 170m * Keine Seitenstrahlung * IR Reflow und TTW Loten geeignet * Feuchte-Empfindlichkeitsstufe 2 nach JEDEC Standard J-STD-020C Anwendungen * Miniaturlichtschranken und Lichtschranken uber groe Entfernungen * Industrieelektronik * Messen/Steuern/Regeln" * Automobiltechnik * Sensorik * Alarm- und Sicherungssysteme Typ Type SFH 4276 1) Features * Black coloured TOPLED-package * Typical Peakwavelength 655nm * Emission area with diameter 170m * No side emission * Suited for IR Reflow and TTW-soldering * Moisture sensitivity level 2 according to JEDEC Standard J-STD-020C Applications * Miniature and long distance photointerrupters * * * * * Industrial electronics For drive and control circuits Automotive technology Sensor technology Alarm and safety equipment Bestellnummer Ordering Code Q65110A2524 Strahlstarkegruppierung 1) (IF = 50 mA, tp = 20 ms) Radiant intensity grouping 1) Ie (mW/sr) 1.2 (0.63 < ... < 2) gemessen bei einem Raumwinkel = 0.01 sr / measured at a solid angle of = 0.01 sr 2008-01-14 1 SFH 4276 Grenzwerte (TA = 25 C) Maximum Ratings Bezeichnung Parameter Betriebs- und Lagertemperatur Operating and storage temperature range Sperrspannung Reverse voltage Durchlastrom Forward current Pulsstrom, = 10 s, D = 0.1 puls current Verlustleistung Power dissipation Symbol Symbol Wert Value - 40 ... + 100 5 50 500 125 300 Einheit Unit C V mA mA mW K/W Top; Tstg VR IF IFp Ptot Warmewiderstand Sperrschicht - Umgebung bei RthJA Montage auf FR4 Platine, Padgroe je 16 mm2 Thermal resistance junction - ambient mounted on PC-board (FR4), padsize 16 mm2 each Elektrostatische Entladung Electrostatic discharge ESD 2 kV 2008-01-14 2 SFH 4276 Kennwerte (TA = 25 C) Characteristics Bezeichnung Parameter Wellenlange der Strahlung Wavelength at peak emission IF = 20 mA, tp = 20 ms Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 20 mA Abstrahlwinkel Half angle Aktive Chipflache Active chip area Durchesser der aktiven Chipflache Diameter of the active chip area Durchlaspannung, Forward voltage IF = 50 mA, tp = 20 ms Sperrstrom, Reverse current VR = 5 V Gesamtstrahlungsflu, Total radiant flux IF = 50 mA, tp = 20 ms Temperaturkoeffizient von Ie bzw. e Temperature coefficient of Ie or e IF = 50 mA Temperaturkoeffizient von VF Temperature coefficient of VF IF = 50 mA Temperaturkoeffizient von Temperature coefficient of IF = 50 mA Symbol Symbol peak Wert Value 655 Einheit Unit nm 16 nm 60 0.019 170 2.1 ( 2.6) Grad deg. mm2 m V A D VF IR 0.01 ( 10) A e 3.5 mW TCI -0.5 %/K TCV -2.5 mV/K TC 0.14 nm/K 2008-01-14 3 SFH 4276 Strahlstarke Ie in Achsrichtung gemessen bei einem Raumwinkel = 0.01 sr Radiant Intensity Ie in Axial Direction at a solid angle of = 0.01 sr Bezeichnung Parameter Strahlstarke Radiant intensity IF = 50 mA, tp = 20 ms Symbol -K Iemin Iemax 0.63 1.25 Werte Values -L 1 2 mW/sr Einheit Unit 2008-01-14 4 SFH 4276 Relative Spectral Emission Irel = f () 100 OHF02939 Radiant Intensity Ie/Ie(50 mA) = f (IF) 101 OHF02937 Max. Permissible Forward Current IF = f (TA) 70 mA 60 OHF02940 I rel % 80 Ie Ie (50 mA) IF R thJA = 300 K/W 100 50 40 30 60 5 40 10 -1 20 20 5 10 0 600 10-2 -1 10 620 640 660 nm 700 5 10 0 5 10 1 5 10 2 mA 10 3 0 0 20 40 60 80 C 100 IF TA Forward Current IF = f (VF) single pulse, tp = 20 s 10 0 A OHF02938 Radiation Characteristics Irel= f () 40 30 20 10 0 (Farfield) OHL01660 1.0 IF 50 0.8 10 -1 5 60 0.6 10 -2 5 70 0.4 0.2 10 -3 5 80 90 100 1.0 0.8 0.6 0.4 0 20 40 60 80 100 120 0 10 -4 1 1.5 2 2.5 V3 VF Permissable Puls Handling Capability IF = f (), TA = 25C, Radiation Pattern Ee rel = f (d) (5mm) 100 % 80 OHF02941 duty cycle D=parameter 0.6 IF A 0.5 OHF02942 D= T tP tP IF T D= 0.4 0.005 0.01 0.02 0.05 0.1 0.2 0.5 DC 60 40 0.3 0.2 20 0.1 0 -6 -4 -2 0 2 4 mm 6 0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102 d tp (d=pattern size at 5mm distance) 2008-01-14 5 SFH 4276 Mazeichnung Package Outlines 2.1 (0.083) 3.0 (0.118) 2.6 (0.102) 2.3 (0.091) 2.1 (0.083) 0.1 (0.004) (typ.) 1.7 (0.067) 0.9 (0.035) 0.7 (0.028) (2.4 (0.095)) 3.4 (0.134) 3.0 (0.118) 1.1 (0.043) 3.7 (0.146) 3.3 (0.130) 0.5 (0.020) 0.6 (0.024) 0.4 (0.016) 0.18 (0.007) 0.12 (0.005) GPLY7024 Cathode marking Optical eye Mae in mm (inch) / Dimensions in mm (inch). Gehausefarbe: schwarz, Verguss klar Brechungsindex Verguss: 1.53 Package Colour: black, resin colourless clear Refractive index resin: 1.53 2008-01-14 6 SFH 4276 Empfohlenes Lotpaddesign Recommended Solder Pad Reflow Loten Reflow Soldering 2.6 (0.102) 1.5 (0.059) 4.5 (0.177) 2.6 (0.102) Padgeometrie fur verbesserte Warmeableitung Paddesign for improved heat dissipation Lotstopplack Solder resist Cu-Flache > 16 mm 2 Cu-area > 16 mm 2 OHLPY970 Mae in mm (inch) / Dimensions in mm (inch) Gehause fur Wellenloten (TTW) geeignet / Package suitable for TTW-soldering 2008-01-14 7 1.5 (0.059) 4.5 (0.177) SFH 4276 Lotbedingungen Soldering Conditions Reflow Lotprofil fur bleifreies Loten Reflow Soldering Profile for lead free soldering I OHLA0687 Vorbehandlung nach JEDEC Level 2 Preconditioning acc. to JEDEC Level 2 (nach J-STD-020C) (acc. to J-STD-020C) 300 C 255 C 240 C 217 C 200 T 250 Maximum Solder Profile Recommended Solder Profile Minimum Solder Profile C 260 C +0C -5 245 C 5 C C 235 C +5C -0 10 s min 30 s max 150 120 s max 100 Ramp Up 3 K/s (max) 25 C 0 0 50 100 150 200 100 s max Ramp Down 6 K/s (max) 50 250 s 300 t 2008-01-14 8 SFH 4276 Lotbedingungen Soldering Conditions Wellenloten (TTW) TTW Soldering Vorbehandlung nach JEDEC Level 2 Preconditioning acc. to JEDEC Level 2 (nach CECC 00802) (acc. to CECC 00802) OHLY0598 300 C T 250 235 C ... 260 C 10 s Normalkurve standard curve 2. Welle 2. wave Grenzkurven limit curves 200 1. Welle 1. wave 150 100 C ... 130 C 100 2 K/s 50 Zwangskuhlung forced cooling ca 200 K/s 5 K/s 2 K/s 0 0 50 100 150 t 200 s 250 Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com (c) All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2008-01-14 9 |
Price & Availability of SFH4276
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |